Board-to-Board Connectors Market: Trends, Growth Drivers,
and Market Segmentation
The Board-to-Board Connectors market is witnessing
substantial growth fueled by the increasing demand for compact, high-speed, and
reliable interconnect solutions across various electronic devices and systems.
This report offers a comprehensive analysis of the Board-to-Board Connectors
market landscape, exploring key trends, growth drivers, and market segmentation
to provide stakeholders with valuable insights into this evolving industry.
Understanding
Board-to-Board (BTB) Connectors: A Comprehensive Guide
Board-to-board (BTB) connectors play a crucial role in
transmitting signals between printed circuit boards (PCBs). These connectors
are essential in a variety of consumer devices and have become increasingly
important with the rise of the Internet of Things (IoT) and Industrial Internet
of Things (IIoT) across multiple industries. In this article, we will explore
the different types of BTB connectors, their design considerations, and the
materials used to manufacture them, providing you with a thorough understanding
of these vital components.
The Anatomy of BTB
Connectors
BTB connectors are composed of a housing and terminals made
from conductive materials, typically copper alloy. The terminals are often
plated to enhance conductivity and prevent rust. There are two main mounting
techniques for BTB connectors:
1. Through-Hole
Technology (THT): Pins are inserted through holes in the PCB and soldered
on the opposite side.
2. Surface-Mount
Technology (SMT): The connector is mounted directly onto the surface of the
PCB.
Types of
Board-to-Board Connectors
1. Parallel Backplane
Connectors: Parallel backplane connectors create a complete computer bus
that supports multiple daughter boards. Historically used in mainframe
computers, these connectors are now common in top-of-rack switch applications
and hybrid hard drive (HHD) clusters.
2. Mezzanine
Connectors: Mezzanine connectors are high-speed connectors that stack two
parallel PCBs. This configuration is ideal for applications requiring compact
and reliable connections.
3. Edge Card
Connectors: Edge card connectors connect perpendicular to the motherboard
in a coplanar configuration, typically using right-angle connectors to maintain
a consistent plane.
4. Flexible Printed
Circuit (FPC) Connectors: FPC connectors are used in small devices such as
consumer electronics. They feature small pin pitches, low profile heights, and
high-density arrangements, making them suitable for compact spaces.
5. Floating
Connectors: Floating connectors can absorb misalignments in the “x” and “y”
directions, ensuring reliable connections even if the PCB interface is not
perfectly aligned.
Notable BTB Connector
Series
Phoenix Contact
FINEPITCH Series: This series offers both shielded and unshielded solutions
for signal and data transmission. It provides various PCB orientations,
designs, stack heights, and pin pitches, catering to diverse connection needs,
including mezzanine, coplanar, and mother-daughter card configurations.
JAE AX01 Series:
Known for its floating tolerance of +/-0.5 mm in both the X and Y directions,
this series is designed to handle misalignments effectively.
Design Considerations
When specifying BTB connectors, several key factors must be
considered:
- Housing Size and
Material: Determines the connector’s durability and suitability for
specific applications.
- Number of Contacts
and Contact Rows: Affects the connector’s capacity and density.
- Stacking Height:
Measured from the PCB, influencing the overall space utilization.
- Contact Length and
Pin Pitch: Impact signal integrity and connection reliability.
- Termination Method:
Choice between THT and SMT affects ease of assembly and performance.
Signal Integrity
(SI): Ensuring effective communication without distortion is critical.
Issues such as crosstalk, return loss, attenuation, and electromagnetic
interference (EMI) must be minimized.
Density:
High-density connectors allow more connections in a smaller area, reducing the
overall size and weight of the connector.
Stack Height:
Lower stack heights reduce the space taken up by the connector, which is
beneficial in compact designs.
Insulating Materials
Plastic insulators are crucial for holding conductors in the
desired shape. Different insulators offer varying levels of strength,
weatherability, and chemical resistance. Some common insulators include:
Polybutylene
Terephthalate (PBT): Excellent dielectric strength, formability, low
flammability, and impact strength.
Acrylonitrile
Butadiene Styrene (ABS): Good impact toughness, wear resistance, and an
economical choice with a shiny appearance.
High-Performance
Polyamide (PA 46, PA 6T): High-temperature resistance, good elongation, and
rigidity, available in halogen-free options.
Liquid-Crystal
Polymer (LCP): Exceptional dimensional stability, weatherability, chemical
inactivity, and moldability, suitable for high-precision designs.
Packaging Options
Packaging ensures the protection and ease of handling BTB
connectors during transportation. Common packaging methods include:
- Bulk (PE bag or small box)
- Trays
- Tubes, with optional Pick and Place (P&P) Cap or
Kapton tape
- Tape and Reel (T&R), with optional P&P Cap or
Kapton tape
- Custom packaging solutions
The Resilience of
Board-to-Board Connectors in Modern Applications
In industries like aerospace, industrial automation,
transportation, and healthcare, the reliability of board-to-board (BTB)
connectors is non-negotiable. These connectors are integral in ensuring
seamless signal transmission between printed circuit boards (PCBs). However,
the environments in which they operate are often harsh, characterized by
mechanical stressors such as shock, vibration, and oscillations, as well as
thermal and chemical challenges from extreme temperatures, corrosive gases,
moisture, and dirt. To withstand these conditions, manufacturers employ
advanced materials and innovative design strategies to enhance the durability
and performance of BTB connectors.
Robustness Amidst
Miniaturization
The trend towards miniaturization in modern electrical
engineering means that components, including connectors, must become smaller
and more powerful while still enduring the same level of environmental stress.
Despite their reduced size, high-quality connectors today not only match but
often surpass the robustness of their larger predecessors. This advancement is
due to improvements in material composition and product design, such as refined
geometries of insulator materials.
Key Factors
Influencing Connector Robustness
Several factors influence the robustness of BTB connectors,
including surface treatment, contact design, contact systems, termination
technology, insulator material design, and tolerance ranges.
Surface Treatment
Durability of
Plating: The durability of a connector is often determined by the quality
of its plating, which impacts the number of mating cycles it can withstand.
Frequent micromovements can cause abrasions and oxide formation, leading to
increased contact resistance and poorer signal transmission. High-quality
contact coatings are essential to mitigate surface abrasion and maintain
reliable connections.
Contact Design
Stamped vs. Turned
Contacts: Stamped contacts, created using CNC machines, often have
inhomogeneous surfaces that can increase surface abrasion and contact
resistance. Designing contacts to minimize these issues is crucial for
maintaining low resistance and high reliability.
Contact System
Double-Sided and
Gender-Neutral Contacts: Traditional connectors have separate male and
female contacts, but in high-shock environments, male contacts can lift off,
causing interruptions. Double-sided female contacts provide redundancy,
ensuring continuous signal transmission. Gender-neutral contact systems, with
identical contact geometries on both halves, further enhance robustness and
reliability.
Termination
Technology
Press-Fit and
Surface-Mount Technologies: Press-fit technology aims to achieve strong
retention forces with minimal press-fit force, crucial for withstanding shock
and vibration. Surface-mount technology (SMT), using solder paste to attach
connectors, is another method that provides reliable connections, especially
when PCBs are assembled on both sides or space is limited.
Insulator Material
Design
Protection and
Alignment: The design of insulator materials is vital for protecting
contacts from damage during operation or assembly. Inclined insertion surfaces
and capture ranges help compensate for misalignments, allowing connector halves
to mate without damage even when there is a center or angle offset.
Tolerance Range
Compensating for
Mechanical Movements: The ability of a connector to compensate for
mechanical movements in all directions (X, Y, and Z) is critical. Secure
mating, which describes the overlap area of male and female connectors, allows
for different board-to-board distances and tolerance ranges, ensuring the
connector remains robust under various operational conditions.
Market Overview:
Board-to-Board connectors play a critical role in
establishing electrical connections between printed circuit boards (PCBs)
within electronic devices and systems. The market's growth is driven by the
rapid proliferation of electronics in applications such as telecommunications,
automotive, consumer electronics, industrial automation, and healthcare,
necessitating efficient and compact interconnect solutions.
Segmentation
Analysis:
By Pitch Size:
- < 0.5 mm
- 0.5 mm to 1 mm
- 1 mm to 2.54 mm
- > 2.54 mm
By Connector Type:
- Board-to-Board Stacking Connectors
- Board-to-Board Mezzanine Connectors
- Board-to-Board Card Edge Connectors
- Board-to-Board Power Connectors
- Others
By End-Use Industry:
- Telecommunications
- Automotive
- Consumer Electronics
- Industrial Automation
- Healthcare
- Aerospace and Defense
- Others
By Mounting Style:
- Surface Mount
- Through-Hole
By Region:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East & Africa
Dominating Companies
in Board-to-Board Connectors Market
- TE CONNECTIVITY
- AMPHENOL CORPORATION
- HIROSE ELECTRIC CO., LTD.
- Molex (a subsidiary of Koch Industries)
- JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.
- OMRON CORPORATION
- SAMTEC
- CSCONN CORPORATION
- FIT HON TENG LIMITED
- AVX Corporation (a subsidiary of Kyocera Corporation)
- HARTING TECHNOLOGY GROUP
- 3M
- ERNI DEUTSCHLAND GMBH
- HARWIN
- EPT GMBH
- KEL CORPORATION
- METZ CONNECT GMBH
- SMK CORPORATION
- ACES ELECTRONICS CO., LTD.
- AIRBORN, INC.
- AUK
- ROSENBERGER
- JST SALES AMERICA, INC.
- IRISO ELECTRONICS CO., LTD.
- YAMAICHI ELECTRONICS CO.
- PHOENIX CONTACT
- Advanced Interconnections Corp.
- FCI Electronics (now part of Amphenol ICC)
- Fujitsu Component Limited
- Panasonic Corporation
- Sullins Connector Solutions
- Würth Elektronik GmbH & Co. KG
Key Trends and
Insights:
- High-Speed Data
Transmission: The increasing adoption of high-speed data transmission
technologies, such as USB, HDMI, and Ethernet, is driving the demand for
board-to-board connectors with enhanced signal integrity and bandwidth
capabilities.
- Miniaturization and
High-Density Interconnects: The trend towards miniaturization in electronic
devices is driving the development of compact board-to-board connectors with
high-density interconnects, enabling space-saving designs and improved system
performance.
- Modular and
Stackable Designs: Modular and stackable board-to-board connector designs
offer flexibility and scalability, allowing manufacturers to customize
interconnect solutions for specific application requirements and simplify
assembly processes.
- Industry 4.0 and
IoT Integration: The integration of board-to-board connectors in Industry
4.0 and IoT devices and systems is driving the demand for rugged, reliable, and
high-performance connectors capable of withstanding harsh operating
environments and facilitating seamless data connectivity.
Market Drivers:
- Increasing
Electronics Integration: The growing integration of electronics in
automotive, telecommunications, and consumer electronics applications is
driving the demand for board-to-board connectors with higher pin counts,
enhanced signal integrity, and compact form factors.
- Automotive
Electronics Growth: The proliferation of electronic components in modern
vehicles, including advanced driver assistance systems (ADAS), infotainment
systems, and electric vehicle (EV) platforms, is fueling the demand for
board-to-board connectors with robust performance and reliability.
- Emerging
Technologies Adoption: The adoption of emerging technologies such as 5G,
artificial intelligence (AI), and Internet of Things (IoT) is driving the need
for board-to-board connectors capable of supporting high-speed data
transmission, power delivery, and signal integrity in next-generation
electronic devices and systems.
Conclusion:
The Board-to-Board Connectors market presents lucrative
opportunities for stakeholders across various industries, driven by
technological advancements, industry-specific applications, and the growing
demand for compact, high-speed, and reliable interconnect solutions.
Understanding market segmentation, key trends, and growth drivers is essential
for companies to capitalize on the expanding market landscape and address the
evolving connectivity needs of modern electronic devices and systems.